PCB multi plate is used for electrical products in the multilayer circuit boards, multilayer board with more single panel or double panel wiring board. A two-sided as inner layer and the second single for outer layer or two double as inner layer, two single-sided printed circuit board of the outer and the positioning system and insulation materials bonded together and conductive pattern according to the design requirements of interconnected printed circuit board becomes four layers and six layer printed circuit board the alternately, also known as multilayer printed circuit board.
With the continuous development of SMT (surface mount technology), and a new generation of SMD (surface mount device) has introduced, such as QFP, QFN, CSP, BGA (especially MBGA), electronic products more intelligent, miniaturization, thus to promote the major reform of the PCB industry technology and progress. Since 1991, IBM company successfully developed a high density multilayer board (SLC), the major countries have also developed a variety of high density interconnect (HDI) micro plate. With the rapid development of these processing technologies, the design of PCB has been gradually developed to the direction of multi layer and high density wiring. Multilayer printed boards are widely used in production and manufacture of electronic products with flexible design, stable and reliable electrical performance and superior economic performance.

The present situation and development of multilayer printed boards
Senior categories will certainly become the estate, multilayer board since 8 0 time, since the latter half of the output value of 1 year 10% (and before a year) than the speed increase. The components to the ` light, thin, short and small "rapid development, multilayer printed circuit board industry is one of the most influential and the most vitality and become the dominant products. Multilayer structure will be diversified, thin, and M M C a l structure will be faster development of multilayer board requires higher equipment and technology investment. The future high level multilayer board will focus on strength of male P C B manufacturers in the development and production.

Development trend of multilayer boards in the future:
High density;
Multi layer thin (high);
Diversification of multilayer board structure;
The thin substrate of thin copper box of high performance;
The surface roughness and surface coating technology in Gaoping;
Flexible multilayer board and rigid flexible multilayer board.