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Brief description of the PCB circuit board production process steps


Printed circuit board design process including schematic design, electronic components database login, design preparation, block division, electronic components configuration, configuration confirmation, wiring and final inspection. In the process, no matter in which process to find the problem, must be returned to the last process, to re confirm or correct.
1, according to the circuit function need to design the principle diagram. Schematic design is mainly according to the electrical properties of the various components according to the need of reasonable structures, through the graph can accurately reflect the important function of the PCB circuit board, and between the various components. The design of schematic diagram is the first step in the PCB production process, and it is also a very important step. The software that is used to design the circuit principle diagram is PROTEl.
2, schematic design is completed, the need for more recent step through the PROTEL to the various components of the package, in order to generate and achieve components with the same appearance and size of the grid. Packaging components after modification, to enforce the rules Edit/Set Preferencebrin 1 setup package reference point in the first pin. Then we have performed Report/Component rule check settings complete to check and OK. So far, the package has been established.

3, the official formation of PCB. After the network generation, it is necessary to place the location of each component according to the size of the PCB panel, in place to ensure that the various components of the wire does not cross. Placement of components after the completion of the final DRC check to exclude the various components in the wiring pin or lead cross error, when all the errors are excluded, a complete PCB design process is completed.
4, the design completed the PCB printed by inkjet printer output, then will be printed circuit diagram side and copper relative compaction by using special carbon paper, finally into the heat exchanger thermal printing by at high temperatures will carbon paper on the circuit diagram of the ink stick onto a copper plate.

5, the system board modulation solution, sulfuric acid and hydrogen peroxide by 3:1 are modulated, and then will contain the ink plate into which, three to four minutes or so, copper in addition to ink are corrosion will take to copper, and then the water will wash out solution.
6, drilling. The punch will copper need to leave holes where drilling, after the completion of the individual matching components from the back of the copper will be two or a plurality of pins which are introduced, and then the welding tool for welding of components onto a copper plate.
7, welding after the completion of the work, the entire circuit board of comprehensive test, if a problem arises in the testing process, you need to through the first step in the design of schematic diagram to determine the position, then re welding or replacement of components. When the test is passed, the whole circuit board is finished.
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