产品类型 Product Classification |
产品关键能力项目 Key items |
当前能力 Current ability |
2015年底 The end of year 2015 |
2016年底 The end of year 2016 |
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生产能力 production capacity |
生产能力 production capacity |
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高多层板 high multi-layer |
层数layers | 12L(P) | 16L(P) | 20L(P) | ||
内层线宽/线距(mil) Min.Trace width/space of inner layer (mil) |
4/4 | 4/4 | 3/3 | |||
内层芯板厚度(mm) Thickness of core material in inner layer |
0.2 | 0.15 | 0.1 | |||
外层线宽/线距(mil) Trace width/space of outer layer (mil) |
4/4 | 4/4 | 3/3 | |||
板厚孔径比 Board thickness to hole diameter ratio |
7:1 | 8:1 | 10:1 | |||
最小钻咀(mm) Min.drilling bit |
0.2 | 0.2 | 0.15 | |||
最大成品板厚(mm) Max.finish board thickness |
4 | 5 | 6 | |||
阻抗公差 Impedance Tolerance |
10% | 8% | 7% | |||
机械盲孔板 Mechanical blind hole in PCB |
层数layers | 8L(P) | 10L(P) | 12L(P) | ||
多次机械盲孔压合次数 Press times of Mechanical blind hole |
1 | 2 | 3 | |||
内层线宽/线距(mil) Min.Trace width/space of inner layer (mil) |
4/4 | 4/4 | 3/3 | |||
外层线宽/线距(mil) Trace width/space of outer layer (mil) |
4/4 | 4/4 | 3/3 | |||
特种板/工艺 Special Technolohy |
铝基板 Aluminum PCB |
单面板 1L |
多层FR-4铝基 Multilayer FR4 aluminum 铝基板夹芯双面铝基板 Double aluminum PCB |
多层冷板 Multilayer cooling PCB |
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阶梯板控制能力(mm) Control ability of stepstair PCB |
R&D | +/-0.20 | +/-0.10 | |||
厚铜板 Thick copper PCB | 3 OZ(P) 4 OZ(S) | 4OZ(P) 5OZ(S) | 5 OZ(P) 6 OZ(S) | |||
Remark | R&D:研发阶段,S:样品sample,M:小量small qty,P:批量batch |